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  1.    #1  
    Hey, i have two questions:

    first: how is the heat issue with new devices like the pre2 or veer. i know nobody has had a veer in use but on the hp event they have used it the hole day, it seems there is not a big problem with heat anymore

    second: i have toughed about building some kind of heat pipes into my pixi. the heat is comming form one spot (bottom right corner - under the metal plate?) i wanted to build a heatpipe plate which covers the battery, so heat can be turned from that one spot the a bigger area. has anybody tried something like this?
    Copper is not magnetical, so the touchstone should be no problem.
  2. ggendel's Avatar
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    #2  
    Quote Originally Posted by DirkGently View Post
    Hey, i have two questions:

    first: how is the heat issue with new devices like the pre2 or veer. i know nobody has had a veer in use but on the hp event they have used it the hole day, it seems there is not a big problem with heat anymore

    second: i have toughed about building some kind of heat pipes into my pixi. the heat is comming form one spot (bottom right corner - under the metal plate?) i wanted to build a heatpipe plate which covers the battery, so heat can be turned from that one spot the a bigger area. has anybody tried something like this?
    Copper is not magnetical, so the touchstone should be no problem.
    Thanks for the new word... "magnetical"

    I don't think, just because copper is non-ferrous, it will work with the touchstone. If I understand the touchstone correctly, the magnetic property is just to adhere the phone to the touchstone. The transfer of power and other communication signals are done via inductance between a coil in the touchstone and the one in the phone's back. To do this properly, you really need a non-conductive solution.
    Palm III->Palm IV->Palm V->M130->Tungsten->Treo 270->Treo 600->Treo 700->Palm Pre Plus->FrankenPre 2->Pre 3 & TouchPad

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